BSP-Backed Embedded Application

Wed, 15 Apr 2026 10:00:00 +0000

🛠 Technology Stack

Languages: Bare-Metal C (C11)
Hardware: STM32F407 (Discovery Board) - ARM Cortex-M4
Simulation: Renode (Antmicro)
Protocols: UART (USART2), SysTick Timer logic
Tools: arm-none-eabi-gcc, GDB, Renode

The Project Overview

A modular firmware application demonstrating a clean separation between hardware-specific drivers (BSP) and high-level application logic. The project focuses on non-blocking execution, architectural maintainability, and full system virtualization using the Renode framework.

Technical Highlights

Layered Architecture (BSP): All register-level operations (RCC, GPIO, UART) are encapsulated within a dedicated Board Support Package. The application layer interacts only with abstract APIs, containing zero raw register addresses.
Non-Blocking Logic: Replaced “busy-wait” loops with a SysTick-based interrupt system, allowing the CPU to process concurrent tasks (LED Heartbeat and Status Reporting) without stalling the execution thread.
UART Serial Driver: Developed a custom driver for USART2, featuring manual Baud Rate calculation for the 16 MHz HSI clock to ensure stable 115200 baud communication.
Virtual Hardware Validation: Successfully virtualized the STM32F407 hardware environment in Renode, enabling cycle-accurate firmware testing and UART output auditing without physical silicon.

Simulation & Hardware Verification

The project is validated using Renode to audit register-level interactions and verify the timing logic of the Board Support Package. By mapping the internal USART2 peripheral to a virtual analyzer, the firmware execution is audited for cycle-accurate behavior before deployment to physical silicon.

Firmware Architecture on Vamsi Kiran | Firmware Engineer

BSP-Backed Embedded Application

🛠 Technology Stack

The Project Overview

Technical Highlights

Simulation & Hardware Verification